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Charging Pile Copper Substrate

Jetronl-battery28


Board thickness: 3.0MM
Production process: exposure process
Quality certification: ULE354470/ISO/SGS/IATF16949
Solder mask type: black oil
E-T test: 100% computer open short circuit test
Withstand voltage: AC2500-4000V
Copper foil thickness: 30Z
Thermal conductivity: 3.0w/m.k
Surface treatment: OSP
Delivery time: Sample: 1-3 days Batch: 5-7 days
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