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Multilayer Board Automatic Depaneling Machine

Jetronl-FBJ01
jetronl-FBJ01: In the multi-layer lamination process of the circuit board (PCB), multi-panel lamination is often used to increase production. This machine can effectively replace manual work. Through the imaging system algorithm, it can automatically find the edge and identify the center line of the product panel. Through the central control system, it can realize automatic disassembly, automatic edge cutting and recycling, and effectively improve productivity; supplemented by the air cooling system, the laminate (PCB) is naturally cooled to room temperature, which is more in line with the post-process operation.
Plate thickness
0.3-3.5mm
Copper thickness
1/3~4oz
Production efhciency
sheet/20sec (1 spell 4)
Copper edge recovery rate
Leave margin<5mm
Cold alate mathod(optional)
Air Cooling
Receiving method
Horizontal material collection

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